[DNM] ihp-sg13g2: Generic pad.tcl script#3936
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dnltz wants to merge 2 commits intoThe-OpenROAD-Project:masterfrom
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[DNM] ihp-sg13g2: Generic pad.tcl script#3936dnltz wants to merge 2 commits intoThe-OpenROAD-Project:masterfrom
dnltz wants to merge 2 commits intoThe-OpenROAD-Project:masterfrom
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Provide a generic pad.tcl script to create a padfram for the IHP SG13G2 platform. The design speicifc config.mk has to define all pins for the north, south, east and west bank. This padframe will the 70x70 bondpad by default, but can use another bondpad via IO_BONDPAD_NAME and IO_BONDPAD_SIZE. Signed-off-by: Daniel Schultz <dnltz@aesc-silicon.de>
Use the platform specific pad.tcl file and only provide all pins for each bank. Signed-off-by: Daniel Schultz <dnltz@aesc-silicon.de>
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Provide a generic pad.tcl script to create a padfram for the IHP SG13G2 platform. The design specific config.mk has to define all pins for the north, south, east and west bank.
Additionally, switch the I2C GPIO Expander to this script.